EOS P770

EOS P 770

SmartScaling compensates for shrinkage behavior and ensures accurate dimensional accuracy. Widely used sensor technology coupled with optical and thermal monitoring systems can achieve outstanding process monitoring capabilities to meet the requirements of the aerospace and automotive industries. With the aid of Eosystem, the equipment can be operated intuitively. EOS SPRINT 2 supports software integration of CAD systems, such as NX from Siemens, and connects to ERP systems via eos connect. The EOSP500 therefore supports digital control of the production process. Automated interfaces and optimized fittings can dramatically shorten the production cycle and ensure that the molding process lasts several days without maintenance. By supporting 10 commercial polymer materials and 18 material/thickness combinations, EOS sets a new benchmark for material diversity. In addition, with the help of the EOS parameter editor, custom parameters can be specified based on the verified initial sintering parameters. After the production is completed, the cooling table can provide the favorable conditions for the cooling process. This helps to ensure accurate performance of finished components-especially excellent dimensional accuracy and surface quality stability. MATERIAL SUPPORT: PA 1101, PA 1102 black, PA 2200, PA 2201 Molding Size: 700x 380x 580mm layered thickness: 0.06 mm, 0.10 mm, 0.12 mm, 0.15 mm, 0.18 mm limited scanning speed: Up to 2X 10m/s